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With the expansion of the market, higher requirements have been put forward for improving productivity and finished product qualification rate. In addition to the rapid spread of second-hand laser cutting machine processing, laser processing has become a mainstream process in high-brightness LED sapphire processing.
The term LED is very familiar to everyone. LEDs are widely used in LCD TV backlights, automotive headlamps, lighting equipment, etc. In recent years, the LED industry is very popular and is expected to appear in the future. The expansion of the long-term market. For the sapphire used in high-brightness LEDs, the previous mainstream processing method is to use a tool for cutting.
According to the G3 comprehensive report: However, with the expansion of the market, higher requirements for improving productivity and finished product qualification rate, coupled with the rapid spread of laser processing, laser processing has become a mainstream process in high-brightness LED sapphire processing. However, cutting tools is not easy. What problems such as burrs and irregularities often occur? What are the ways we can avoid these problems?
"In the development of LED wafer dicing technology, it has been developed from diamond cutting to laser cutting. Laser cutting has advantages over traditional diamond dicing technology in terms of product yield and operating cost." Shenzhen Dazu Laser Tang Jiangang, general manager of the Precision Laser Micromachining Center, said.
In the Taiwan chip line generally requires more than 30um depth requirements, LED wafer manufacturing technology is developing rapidly. In order to improve luminous efficiency and brightness, wafer structure changes often make dicing equipment face great challenges. Traditional diamond tools Cutting has not been able to meet market needs.
It is understood that the diamond dicing machine relies on the skill level of the operator in the operation process, so the qualified rate of the finished product is unstable, and the quality of the processed product is uneven. In addition, the operator must pay attention to the device at all times, which is costly, and the diamond tool as a consumable is expensive, extremely wearable, and has a high replacement frequency, resulting in high production cost.
The second-hand laser cutting machine can achieve a cutting speed of more than 100mm/s under the condition of maintaining the same brightness, which is several times of cutting the tool, which can greatly improve the production efficiency and guarantee the mass production.
Fully automatic machine, just input the cutting parameters and install the wafer cassette on the device, it can be fully automatic operation, completely independent of the skill level of the operator. At the same time, the laser belongs to non-contact processing, which does not require consumables and coolant during cutting. It also reduces the workpiece replacement time necessary for the diamond dicing machine, reduces the operator's working time and workload, and further reduces production costs.
At present, laser processing is mainly divided into ablation cutting and stealth cutting. The principle of ablation cutting is a cutting method that focuses the laser on the surface of the workpiece and instantly vaporizes the surface of the workpiece.
In order to ensure the long-term stability of product quality, the UV laser scriber is designed with a precision three-dimensional workbench, fully automatic loading and unloading, and autofocus. Automatic template recognition, angle correction, automatic contour finding, contour correction, automatic glue application and cleaning functions through software. In a short period of time, the industry has been recognized and the market has received enthusiastic response.
The development of technology is endless. The pursuit of higher luminous efficiency of LED chips is unchanged in the industry, and the evolution of upstream chip technology will inevitably lead to technological changes in related equipment.
In order to meet the market's pursuit of higher brightness chips, the invisible second-hand laser cutting machine cutting process is basically the best choice without affecting the brightness of the chip. In the past, stealth cutting technology has been controlled by Japanese companies. The sapphire laser cutting technology of the LED wafer developed by Hamamatsu Photonics Society of Japan, StealthDicing, is the most advanced technology in the field of LED dicing. Obtained the only invention patent in the world.
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