Since the development of the LED lighting industry, white light illumination has been unable to effectively solve the problem of deterioration of packaging materials and low luminous efficiency due to poor heat dissipation. The reasons include the heat dissipation path of the LED package. The LED package, PCB, and heat sink fins are not smooth. The upstream and downstream industries work hard but do not understand each other. Therefore, it is difficult to integrate the advantages and design high-heat LED products. With its excellent technology and design capability, Guanghai Technology integrates LED package, PCB and heat dissipation module into the same heat dissipation module, and obtains 60W high-power LED module with excellent Tj of 61.11 °C. LED product performance indicators Luminous efficiency lm/w: The control factors of luminous efficiency are grain size, phosphor proportion, and heat dissipation rate, respectively. Tjunction temperature control is life or light attenuation control: the grain itself is quite tolerant to thermal shock (10 ° C increase in temperature, luminous efficiency decays less than 1%), but heat is relatively sensitive to all types of fluorescent materials, fluorescence The light conversion efficiency of the material decreases with increasing temperature (Fig. 1), and affects the lifetime of the fluorescent material, especially when the temperature of the fluorescent material exceeds 70 °C, which means that the LED junction temperature (Junction Temperature, Tj) must be controlled. Below 70 ° C, can effectively ensure the service life of the LED (the general life is calculated by L70, the LED decays to 70% of the original brightness), as the basis for life judgment, the requirements are generally more than 20,000 hours. Therefore, the control ability of Tj determines the luminous efficiency and life of the LED. Guanghai Technology has developed a technology that directly encapsulates the LED chip on the Vaporchamber, and has the following advantages. The LED chip is directly packaged on the temperature equalization plate, and only the thermal resistance of the Bonding layer (Fig. 3) between the chip and the temperature equalization plate is used instead of the layer thermal resistance structure of the conventional module (Fig. 4). The uniform temperature plate has a thermal conductivity of at least 800 W/mK, which is twice that of pure copper 400 W/mK, four times that of an aluminum nitride substrate of 230 W/mK, and an aluminum substrate (MCPCB) of 260 times that of 3 W/mK, thereby obtaining excellent thermal conductivity. . The 60W high-power LED module has been measured Tj=61.11°C (Fig. 6), which is the lowest Tj measured by the industry. Easy to control: Guanghai Technology's LED module, because there is only one Bonding layer between the temperature equalizing plate and the chip, the temperature of the measuring temperature plate is almost equal to Tj, so it is easy to control Tj by simply controlling the area of ​​the heat sink fins. And controlling Tj is equivalent to controlling the life of the LED. Low cost: Because the structure of the high-power module does not have the structure of the previous LED module, the LED chip is directly bonded to the temperature equalizing plate, and the process materials in the middle have been omitted, so the cost is the most competitive. mode. The technology of directly packaging the LED chip on the temperature equalizing plate developed by its excellent design capability completely solves the problem of poor heat dissipation of the high-power LED module, and opens up a new path for the high-power LED module.
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