In recent years, with the miniaturization of electronic terminal products, especially portable products such as smart phones and smart watches, high integration, and the increase in raw material costs, patch ceramic capacitors have been developing in a small size. In the mobile phone market, the mainstream MLCC size has been transitioned to 0201 (0.6 × 0.3mm) size, 01005 (0.4 * 0.2mm) size, and even smaller size 008004 (0.2 * 0.1mm) is also evaluated within a few manufacturers. Therefore, many manufacturers have encountered small size placement and manual soldering, rework problems, this article takes the 01005 size as an example for a brief introduction. 01005 size surface mount For the 01005 small size placement, the main influencing factors are as follows: PCB board, MLCC device, solder paste type and solder, placement, reflow soldering conditions. The three steps of solder paste printing, placement and reflow soldering are as follows: 1.1. PCB board PCB uses solder mask design, pad rectangle, size recommended A, B, C corresponds to 0.16mm, 0.16mm, 0.2mm, pad pitch and pad and solder mask accuracy according to JPCA specifications ( ±0.1 mm, ±0.05 mm). 1.2. Solder paste is recommended to use Type 5 solder paste (particle size 10 ~ 25um) and reasonable adjustment of flux ratio. In the atmosphere, if the solder paste does not condense after heating (matte), it may be due to insufficient flux/over-displacement. 1.3. MLCC devices to ensure reliable device performance, the device should be stored at 5 ~ 40 ° C, 20 ~ 70% RH, to avoid direct sunlight and exposure to corrosive gases. It is used in an environment of 45% to 70% RH. If stored for more than 6 months, the weldability should be checked first. 1.4. Printing conditions The shape and size of the stencil opening are recommended to correspond to the PCB pad 1:1, thickness 50 ~ 80um, plating method opening. The printing rate (transfer rate) of the solder paste is related to its initial area ratio (side area/bottom area). It has been determined that for a 20um particle size, to ensure a printing rate of more than 70%, the area ratio should be less than 2. However, insufficient thickness will also lead to too little solder paste layer. Whether it will affect the success rate of placement should be determined according to the specific conditions. 1.5. Mounting conditions The recommended mounting equipment is as follows. For the corresponding nozzles and feeders, please refer to the equipment manufacturer's recommendation. 1.6. Reflow conditions The reflow temperature is set according to the recommended values ​​in the specification and reflow soldering is performed under a nitrogen atmosphere. 01005 size manual welding 2.1. Welding Workbench For manual welding in the laboratory, in order to improve efficiency, it is recommended to select a more advanced soldering station, such as JBC series. The advantage is that the temperature rises quickly and supports continuous welding. Second, the two tips of the soldering iron can be heated simultaneously. . 2.2. Preparation of materials and tools a) Tin wire, tin wire, tweezers b) PCB and device c) Soldering station and small size tip d) Microscope 2.3. Points of attention in the operation process 1) In order to prevent local damage caused by sudden heat and thermal shock, it is recommended to preheat the components and PCB board (above 150 °C, above 90s).
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2) Use a tool to cut the tin wire into a tin block that is about half the size of the pad to avoid excessive tinning.
3) Adjust the microscope to clearly observe the device and the pad. 4) Place the solder on the pad with tweezers and heat it. 5) Place the device with tweezers and heat the ends in turn.