Release date: 2017-11-02 Source: Foreign station sharing: When doing thermal simulation, it is recommended not to use thermal resistance. Instead, the thermal conductivity and related dimensions of each material should be used to set up the simulation. For the simulation of COB, the model should be drawn according to the actual chip, substrate, colloid, etc. when the model is built. If you want to consider the contact thermal resistance, you should set it for each chip. The contact thermal resistance is also set by the thermal conductivity and the size of the medium. Label: How to set the thermal resistance of COB? Distribution Box Distribution Box,Distribution Boxes TUV,CE Distribution Boxes,Distribution Boxes Wenzhou Korlen Electric Appliances Co., Ltd. , https://www.zjmoldedcasecircuitbreaker.com How to set the thermal resistance of COB?
