As communications, computers and their peripheral products and household appliances continue to move toward high-frequency and digital, the miniaturization, integration, and modularization of components are becoming more and more urgent. It has been exaggerated to predict that the future electronics industry will be simplified into the assembly industry – assembling various functional modules together. LTCC (Low Temperature Co-fired Ceramics) will become the first choice for the integration and modularization of electronic devices in the future due to its excellent electrical, mechanical, thermal and process characteristics. It has developed rapidly in foreign countries and Taiwan Province of China, and has initially formed an industrial prototype. LTCC applications increasingly use LTCC to prepare chip passive integrated devices and modules have many advantages. First, ceramic materials have excellent high-frequency and high-Q characteristics. Second, the use of high-conductivity metal materials as conductor materials is beneficial to improve circuits. The quality factor of the system; third, it can adapt to the requirements of high current and high temperature resistance, and has better thermal conductivity than ordinary PCB circuit substrates; fourth, the passive components can be buried in the multilayer circuit substrate, which is beneficial to improve the circuit. Assembly density; fifth, with better temperature characteristics, such as a small thermal expansion coefficient, a small dielectric constant temperature coefficient, can make a very high number of circuit boards, can make a thin line structure with a line width of less than 50μm . In addition, the discontinuous production process allows the green substrate to be inspected, thereby increasing yield and reducing production costs. LTCC devices are roughly classified into LTCC components, LTCC functional devices, LTCC package substrates, and LTCC module substrates according to the number of components they contain and their role in the circuit. Filters and duplexers in early communications products LTCC by Function mostly large volume of dielectric filters and duplexers. Filters on GSM and CDMA handsets have now been replaced by acoustic surface filters or embedded in module substrates, while filters on PHS handsets and cordless phones are mostly small, inexpensive, LC filters made by LTCC. Bluetooth and wireless network cards use LC filters from the beginning. Filters made by LTCC include bandpass, highpass, and lowpass filters, with frequencies ranging from tens of MHz up to 5.8 GHz. LC filters have unparalleled advantages in terms of volume, price and temperature stability, and they are not difficult to understand as they continue to receive widespread attention. The above-mentioned RF devices produced by LTCC have been in foreign countries and Taiwan Province for several years. Japan's Murata, Dongguang, TDK, Shuangxin Motor, Taiwan's Huaxin Technology, ACX, and South Korea's Samsung are all in mass production. And sales. China’s mainland only saw in exhibitions and webpages in 2003 that CSG Electronics and another company started to develop similar products. The LTCC chip antenna WLAN and Bluetooth devices have short communication distances, small transmission and reception power, and low requirements on the power and transmission characteristics of the antenna, but the area and cost of the PCB occupied by the antenna are very strict. The chip antenna prepared by LTCC has the advantages of small size, convenient surface mounting, high reliability, low cost, and the like, and has been widely used for WLAN and Bluetooth. Modular LTCC module board electronics industry has become an indisputable fact that, especially where the preferred mode of LTCC. The module substrates to choose from are LTCC, HTCC (High Temperature Co-fired Ceramics), and conventional PCBs such as FR4 and PTFE (High Performance Polytetrafluorohexene). The sintering temperature of HTCC is above 1500 °C, and the matching refractory metals such as tungsten, molybdenum/manganese have poor electrical conductivity, and the sintering shrinkage is not as easy to control as LTCC. The dielectric loss of LTCC is an order of magnitude lower than RF4. PTFE has lower loss but poor insulation. LTCC provides better control of accuracy than most organic substrate materials. No organic material can be compared to the high frequency performance, size and cost of the LTCC substrate. The research on LTCC module substrates in foreign countries and Taiwan Province in China is in full swing. There are many commercial production and application of LTCC modules. Only the mobile phone antenna switch module (ASM) is produced by Murata, Mitsubishi Electric, Kyocera, TDK, Epcos, Hitachi, Avx and so on. In addition, the Bluetooth modules of NEC, Murata and Ericsson, and the power amplifier modules of Hitachi and other companies are all made by the LTCC process. Due to its compact structure, mechanical shock resistance and thermal shock resistance, the LTCC module has received great attention and wide application in military and aerospace equipment. In the future, its application in automotive electronics will be very extensive. Localization has become an opportunity for the development of LTCC devices. The development of domestic LTCC devices is at least 5 years behind. This is mainly due to the lag in the development of electronic terminal products. LTCC functional devices and modules are mainly used for communication products such as GSM, CDMA and PHS mobile phones, cordless phones, WLAN and Bluetooth. In addition to more than 40 megabytes of cordless phones, these products have been developed in China for nearly five years. In order to seize the market as soon as possible, the original design of the domestic products was mostly bought from abroad, and even the package of components and components was purchased. The purchased products were all selected from foreign components. In the past few years, the main goal of the terminal product manufacturing plant was to expand market share, and the cost pressure was not large enough to take into account the localization of components. With the overcapacity of terminal products, the price and cost competition will become increasingly fierce, and the localization of components will be put on the agenda, which will provide a good market opportunity for the development of domestic LTCC devices. The development and production of LTCC devices must take into account the three aspects of materials, design and process and equipment. Materials LTCC devices require material properties including electrical, thermomechanical and process properties. 0.8mm ( 0.031") Female Header Connector
0.8mm ( 0.031") Female Headers Overview
Through-Hole (Poke-In)
Vertical or Straight Female Header Orientation
One side of the series of pins is connected to PCB board in which the pins can be at a right-angle to the PCB surface (usually called "straight" or [vertical") or.
Single, Dual or Multiple Number of Rows Female Header Connector,0.8Mm Female Pin Header,0.8Mm Female Header,0.8Mm Pcb Header, Pitch 0.8mm Board to Board Connectors ShenZhen Antenk Electronics Co,Ltd , https://www.antenkconn.com
Category:Board To Board Connectors
Sub-Category:Pin Header Female
Type:0.8mm
Whenever there is a need for fitting small-sized connectors in compact devices, the 0.8mm pitch female header, or sometimes referred to as header connector, is ideally suited for this application. Not only does this female header space-savvy, but it is also designed for vacuum pick and place that makes it suitable for high volume automated manufacturing.
Antenk offers these low profile, easy-install, SMT or THM miniature female connector plugs at high quality and affordable China-quoted price, for board-to-board connection, snuggly fitting the pins of a male header and acting as a receptacle.
Assembly and service is simple with either vertical (straight), elevated or at a right angle configuration/orientation, which can dissipate current of about 1.0 A or less in a tape and reel packaging. The filleted corners can also remove shadowing allowing optimization of LED output.
Also, the 0.8mm pitch female headers are made to work in Arduino boards, Arduino Pro and Arduino Mega with either single or double-row female headers, facilitating connections for programming and incorporation into other circuits. They have the perfect height for clearing the USB-B connector and great for stacking multiple shields.
Female header always called as [Header connector", Antenk provide widely range of header connector, from 2.54mm (.100″ inch) pitch to 0.8mm (0.031 inch) pitch. The number of pins (contacts) is from 2 to 40 pins per orw. There are three type: Straight (Dip Vertical), Right angle, SMT (surface mount).
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Applications of 0.8mm Pitch Female Headers
Its small size is most suitable for PCB connections of small equipment and devices such as:
Arduino Boards
Architectural and sign lighting
Retail and display lighting
Fluorescent LED retrofit lighting
Cabinet or furniture lighting
Commercial / residential cove lighting
WiFi equipment
Gaming consoles,
Measurement instruments
Medical Diagnostic and Monitoring equipment
Communications: Telecoms and Datacoms
Industrial and Automotive Control and Test
Mount Type: Through-hole vs Surface Mount
At one side of this female header is a series of pins which can either be mounted and soldered directly onto the surface of the PCB (SMT) or placed into drilled holes on the PCB (THM).
Best used for high-reliability products that require stronger connections between layers.
Aerospace and military products are most likely to require this type of mounting as these products experience extreme accelerations, collisions, or high temperatures.
Useful in test and prototyping applications that sometimes require manual adjustments and replacements.
0.8mm vertical single row female header, 0.8mm vertical dual row female header, 0.8mm Elevated single row female header, 0.8mm Elevated dual row female Header, 0.8mm right-angle single row female header and 0.8mm right-angle dual row female header are some examples of Antenk products with through-hole mount type.
Surface-Mount
The most common electronic hardware requirements are SMT.
Essential in PCB design and manufacturing, having improved the quality and performance of PCBs overall.
Cost of processing and handling is reduced.
SMT components can be mounted on both side of the board.
Ability to fit a high number of small components on a PCB has allowed for much denser, higher performing, and smaller PCBs.
0.8mm Right-angle Dual Row female header, 0.8mm SMT Single row female header, 0.8mm SMT Dual row female header and 0.8mm Elevated Dual Row female Header are Antenk`s SMT female headers.
Soldering Temperature for 0.8mm Pitch Female Headers
Soldering SMT female connectors can be done at a maximum peak temperature of 260°C for maximum 60 seconds.
Orientation/Pin-Type: Vertical (Straight) and Right-Angle
0.8mm pitch female headers may be further classified into pin orientation as well, such as vertical or straight male header or right-angle female header.
Right-Angle Female Header Orientation
Parallel to the board's surface (referred to as "right-angle" pins).
Each of these pin-types have different applications that fit with their specific configuration.
PCB Connector Stacking
Profile Above PCB
This type of configuration is the most common way of connecting board-to-board by a connector. First, the stacking height is calculated from one board to another and measured from the printed circuit board face to its highest insulator point above the PCB.
Elevated Sockets/Female Headers
Elevated Sockets aka Stacked sockets/receptacles or Mezzanine are simply stacked female headers providing an exact distance requirement between PCBs that optimizes electrical reliability and performance between PCB boards.
Choosing this type of stacking configuration promotes the following benefits:
Connector Isolation - the contacts are shrouded preventing cable connection mishaps and good guidance for the mating header connectors.
For off-the-shelf wireless PCB module, stacking height is optimized with elevated sockets.
Offers superior strength and rigidity.
Polarisation prevents users from inverted insertion.
For a 1.0mm straight or vertical female header, the standard number of rows that Antenk offers ranges from 1 to 2 rows. However, customization can be available if 3 ,4 or n number of rows is needed by the customer. Also, the number of contacts for the single row is about 2-40 pins while for dual row, the number contacts may vary from 2-80 pins.
Pin Material
The pins of the connector attached to the board have been designed with copper alloy. With customer`s demand the pins can be made gold plated.
Custom 1.0mm Pitch Female Headers
Customizable 1.0 mm pitch female headers are also available, making your manufacturing process way faster as the pins are already inserted in the headers, insulator height is made at the right size and the accurate pin length you require is followed.
Parts are made using semi-automated manufacturing processes that ensure both precision and delicacy in handling the headers before packaging on tape and reel.
Tape and Reel Packaging for SMT Components
Antenk's SMT headers are offered with customizable mating pin lengths, in which each series has multiple number of of circuits, summing up to a thousand individual part number combinations per connector series.
The tape and reel carrier strip ensures that the headers are packaged within accurately sized cavities for its height, width and depth, securing the headers from the environment and maintaining consistent position during transportation.
Antenk also offer a range of custom Tape and reel carrier strip packaging cavities.